Filtronic awarded £1.2m funding to develop 550W Ka-band solid-state power amplifiers Filtronic plc of Sedgefield and Leeds, UK — which designs and manufactures RF and millimeter-wave (mmWave) transmit & receive components and subsystems for the space, aerospace & defence, and telecoms infrastructure markets — has been awarded £1.2m funding through the UK Space Agency’s National Space Innovation Programme (NSIP) for a project to develop a high-power 550W Ka-band solid-state power amplifier (SSPA)...
https://www.semiconductor-toda....y.com/news_items/202

Smartphone production grows 9% in Q3/2025, driven by seasonal demand and new product releases In second-half 2025, the smartphone market entered its peak season, with new product launches further boosting output, according to the latest research by market analyst TrendForce. In third-quarter 2025, global smartphone production hit 328 million units, up 9% quarter-on-quarter and 7% year-on-year. These numbers highlight a distinct seasonal uptick..
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Infineon enhances Electreon’s wireless in-road EV charging with silicon carbide technology Infineon Technologies AG of Munich, Germany will supply customized silicon carbide (SiC) power modules to Electreon, a provider of wireless charging solutions for electric vehicles (EVs), for its dynamic in-road charging technology...
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ROHM launches 13–65mΩ SiC MOSFETs in TOLL package Japan-based ROHM has begun mass production of the SCT40xxDLL series of silicon carbide (SiC) MOSFETs in TOLL (TO-Leadless) packages. Compared to conventional packages (TO-263-7L) with equivalent voltage ratings and on-resistance, the new packages offer about 39% improved thermal performance, enabling high-power handling despite their compact size and low profile. It is suitable for industrial equipment such as server power supplies and ESS (energy storage systems) where the power density is increasing, and low-profile components are required to enable miniaturized product design...
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Coherent expands silicon carbide platform from 200mm to 300mm Materials, networking and laser technology firm Coherent Corp of Saxonburg, PA, USA says that it has leveraged its 200mm silicon carbide platform expertise to develop a next-generation 300mm silicon carbide solution, engineered to manage rising thermal loads, that meets the accelerating performance and scalability needs of modern data centers. As these systems demand higher power density, faster switching, and superior thermal management, the transition to larger-diameter SiC wafers can unlock major gains in energy efficiency and thermal performance, the firm says...
https://www.semiconductor-toda....y.com/news_items/202